1. The pressure holding test of the medium circulation system is 7 bar.
2. Use high-quality magnetic pump without mechanical shaft seal.
3. Optimize temperature sampling and response speed, specially designed control algorithm, can respond quickly to stable temperature control.
4. Enhance the design of circulating pump capacity to meet the high-lift requirements of the system.
5. Continuous high temperature cooling technology meets the requirements of stable operation when heat is loaded on the heat sink plate and requires constant temperature control of cooling and heating.
6. In view of the volatile characteristics of fluorinated liquid, the joint design and system sealing design are strengthened to ensure the service life of the medium.

1. The pressure holding test of the medium circulation system is 7 bar.
2. Use high-quality magnetic pump without mechanical shaft seal.
3. Optimize temperature sampling and response speed, specially designed control algorithm, can respond quickly to stable temperature control.
4. Enhance the design of circulating pump capacity to meet the high-lift requirements of the system.
5. Continuous high temperature cooling technology meets the requirements of stable operation when heat is loaded on the heat sink plate and requires constant temperature control of cooling and heating.
6. In view of the volatile characteristics of fluorinated liquid, the joint design and system sealing design are strengthened to ensure the service life of the medium.

1. The pressure holding test of the medium circulation system is 7 bar.
2. Use high-quality magnetic pump without mechanical shaft seal.
3. Optimize temperature sampling and response speed, specially designed control algorithm, can respond quickly to stable temperature control.
4. Enhance the design of circulating pump capacity to meet the high-lift requirements of the system.
5. Continuous high temperature cooling technology meets the requirements of stable operation when heat is loaded on the heat sink plate and requires constant temperature control of cooling and heating.
6. In view of the volatile characteristics of fluorinated liquid, the joint design and system sealing design are strengthened to ensure the service life of the medium.

Temperature control range：-85°C ~ 200°C ；Power range：6.5kW~50kW；Temperature control accuracy：±0.3°C

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

  LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

Temperature control range：-45°C ~ 250°C ；Power range：2.5kW~25kW；Temperature control accuracy：±0.3°C

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

  LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations at temperatures (-45°C to +250°C). Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.